Work

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Year: 1997

Type: conference-paper

Source: ASME International Mechanical Engineering Congress and Exposition (IMECE)

DOI: 10.1115/imece1997-0498

Authors: Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Institution: Cornell University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3202239746

FWCI: 1.298

Cites:

Cited by: 18

Related to: 10