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Yu-Jiau Huang
Observed name:
Yuh-Jiau Huang
Institution:
Industrial Technology Research Institute
Observed institution:
Industrial Technology Research Institute
OpenAlex ID:
A5113578268
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
2011
·
Ching-Kuan Lee
, Tao-Chih Chang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
42
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
2012
·
Ching-Kuan Lee
, Tao-Chih Chang
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
33
Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration
2012
·
Ching-Kuan Lee
, Chau-Jie Zhan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Process control of high density solder bumps by electroplating technology
2003
·
Szu-Wei Lu
, Zhao-Hui Wu
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
1
Low temperature micro-bumping assembly technology for 3D integration
2012
·
Yu-Hua Chen
, Ching-Kuan Lee
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
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Works count:
5
Citation count:
87
H-index:
3
I10-index:
3
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