Work

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6248898

Authors: Ching-Kuan Lee, Chau-Jie Zhan, John H. Lau, Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Shang-Wei Chen, Shin-Yi Huang, Chia-Wen Fan, Yu-Min Lin, Kuo-Shu Kao, Cheng-Ta Ko, Tai-Hung Chen, Robert Lo, M. J. Kao

Institution: Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2129807791

FWCI: 1.216

Cites: 23

Cited by: 11

Related to: 10