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Zhi-Cheng Hsiao
Institutions:
ITRI International,
Industrial Technology Research Institute
Observed institutions:
ITRI International,
Industrial Technology Research Institute
OpenAlex ID:
A5111492865
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
2011
·
Ching-Kuan Lee
, Tao-Chih Chang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
42
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
2012
·
Ching-Kuan Lee
, Tao-Chih Chang
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
33
Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
2015
·
Zhi-Cheng Hsiao
, Cheng-Ta Ko
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
·
31
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
2012
·
Cheng-Ta Ko
, Zhi-Cheng Hsiao
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
23
Wafer-to-wafer hybrid bonding technology for 3D IC
2010
·
Cheng-Ta Ko
, Zhi-Cheng Hsiao
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
23
Wafer-level 3D integration using hybrid bonding
2010
·
Cheng-Ta Ko
, Kuan-Neng Chen
, et al.
·
IEEE International D Systems Integration Conference
·
21
Low-cost TSH (through-silicon hole) interposers for 3D IC integration
2014
·
John H. Lau
, Ching-Kuan Lee
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
15
Flexible and ultra-thin embedded chip package
2009
·
Tzu-Ying Kuo
, Ying-Ching Shih
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
14
A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
2014
·
Cheng-Ta Ko
, Zhi-Cheng Hsiao
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
13
Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration
2012
·
Ching-Kuan Lee
, Chau-Jie Zhan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Process and characterization of ultra-thin film packages
2010
·
Tzu-Ying Kuo
, Zhi-Cheng Hsiao
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
4
A novel 3D IC assembly process for ultra-thin chip stacking
2014
·
Yu-Min Lin
, Chau-Jie Zhan
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
3
Process integration of 3D stacking for backside illuminated image sensor
2014
·
Zhi-Cheng Hsiao
, Cheng-Ta Ko
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
3
Electrical investigation and reliability of 3D integration platform using Cu TSVs and micro-bumps with Cu/Sn-BCB hybrid bonding
2013
·
Yao-Jen Chang
, Cheng-Ta Ko
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Manufacturing and stacking of ultra-thin film packages
2009
·
Ying-Ching Shih
, Tzu-Ying Kuo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor
2015
·
Hsiang-Hung Chang
, Zhi-Cheng Hsiao
, et al.
·
International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
·
1
Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
2012
·
Kuan-Neng Chen
, Cheng-Ta Ko
, et al.
·
Journal of Nanoscience and Nanotechnology
·
1
Stretchable circuit with elastic bumps
2008
·
Ying-Ching Shih
, Cheng-Ta Ko
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
Low temperature micro-bumping assembly technology for 3D integration
2012
·
Yu-Hua Chen
, Ching-Kuan Lee
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
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Works count:
19
Citation count:
244
H-index:
10
I10-index:
10
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