Work

Flexible and ultra-thin embedded chip package

Year: 2009

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2009.5074252

Authors: Tzu-Ying Kuo, Ying-Ching Shih, Yuan-Chang Lee, Hsiang-Hung Chang, Zhi-Cheng Hsiao, Chia-Wen Chiang, Shu-Man Li, Yu-Jiau Hwang, Cheng-Ta Ko, Yu-Hua Chen

Institution: Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2139503719

FWCI: 1.872

Cites: 7

Cited by: 14

Related to: 10