Work

Process and characterization of ultra-thin film packages

Year: 2010

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2010.5699606

Authors: Tzu-Ying Kuo, Zhi-Cheng Hsiao, Yin-Po Hung, Wei Li, Kuo-Chyuan Chen, Chao-Kai Hsu, Cheng-Ta Ko, Yu-Hua Chen

Institution: Industrial Technology Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2063549554

FWCI:

Cites: 6

Cited by: 4

Related to: 10