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A.M. Soares

Observed names: A. M. Soares, A. Soares, Anthony Soares, Antonio M. Soares, Antonio Soares, Antônio Marcos Figueiredo Soares
OpenAlex ID: A5113678086
Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology
2005 · V. Suntharalingam, R. Berger, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 123
Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers
2006 · B. Aull, J. Burns, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 56
A monolithic Hough transform processor based on restructurable VLSI
1988 · F.M. Rhodes, J.J. Dituri, et al. · IEEE Transactions on Pattern Analysis and Machine Intelligence · 48
Energy dissipation in a thin polymer film by electron beam scattering: Experiment
1975 · R. J. Hawryluk, Henry I. Smith, et al. · Journal of Applied Physics · 48
A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor
2009 · V. Suntharalingam, R. Berger, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 47
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Generation and Propagation of Single Event Transients in 0.18-$\mu{\rm m}$ Fully Depleted SOI
2008 · Pascale Gouker, Jim Brandt, et al. · IEEE Transactions on Nuclear Science · 42
A wafer-scale digital integrator using restructurable VSLI
1985 · J.I. Raffel, A.H. Anderson, et al. · IEEE Transactions on Electron Devices · 40
A Wafer-Scale Digital Integrator Using Restructurable VSLI
1985 · J.I. Raffel, A.H. Anderson, et al. · IEEE Journal of Solid-State Circuits · 34
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
2009 · C.L. Chen, D-R. Yost, et al. · IEEE International Conference on 3D System Integration (3DIC) · 27
A generic architecture for wafer-scale neuromorphic systems
1989 · J.I. Raffel, Jim Mann, et al. · 27
Characterization of Three-Dimensional-Integrated Active Pixel Sensor for X-Ray Detection
2009 · Gregory Prigozhin, Vyshnavi Suntharalingam, et al. · IEEE Transactions on Electron Devices · 20
High-frequency characterization of sub-0.25-/spl mu/m fully depleted silicon-on-insulator MOSFETs
2000 · C.L. Chen, R.H. Mathews, et al. · IEEE Electron Device Letters · 17
A novel metal-insulator-metal structure for field-programmable devices
1993 · S.S. Cohen, A.M. Soares, et al. · IEEE Transactions on Electron Devices · 17
Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias
2010 · C.L. Chen, D.-R. Yost, et al. · Microelectronic Engineering · 11
High frequency performance of a fully depleted 0.25-μm SOI CMOS technology
2003 · D.D. Rathman, J.A. Burns, et al. · IEEE MTT-S International Microwave Symposium digest · 9
A 64 $\times$ 64-Pixel CMOS Test Chip for the Development of Large-Format Ultra-High-Speed Snapshot Imagers
2008 · Robert Berger, Dennis D. Rathman, et al. · IEEE Journal of Solid-State Circuits · 8
The Lincoln programmable image-processing wafer
2002 · R. Berger, A. Bertapelli, et al. · International Conference on Wafer Scale Integration (ICWSI) · 6
Performance of a low power fully-depleted deep submicron SOI technology and its extension to 0.15 μm
2002 · J.A. Burns, C.L. Keast, et al. · IEEE International SOI Conference (SOI) · 5
A 1.3 GHz SOI CMOS test chip for low-power high-speed pulse processing
1998 · R. Berger, W.G. Lyons, et al. · IEEE Journal of Solid-State Circuits · 4
Design criteria for a fully depleted-0.1 μm SOI technology
2002 · J.A. Burns, R.S. Frankel, et al. · IEEE International SOI Conference (SOI) · 3
Lincoln Laboratory's 3D Circuit Integration Technology
2008 · James Burns, Brian Aull, et al. · 2
Interconnection and testing of a wafer-scale circuit with laser processing
1984 · G. H. Chapman, A. H. Anderson, et al. · Conference on Lasers and Electro-Optics · 2
Mpixel CMOS Image Sensor
2009 · Vyshnavi Suntharalingam, Robert Berger, et al. · 1
Robust subthreshold level conversion
2015 · Joseph Lin, Antonio Soares, et al. · IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
An SOI-Based 3D Circuit Integration Technology
2008 · James Burns, Brian Aull, et al. · Integrated circuits and systems
Works count: 30
Citation count: 598
H-index: 13
I10-index: 14
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