Work

Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

Year: 2005

Type: conference-paper

Source: Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference

DOI: 10.1109/isscc.2005.1494016

Authors: V. Suntharalingam, R. Berger, J.A. Burns, C.K. Chen, C.L. Keast, J.M. Knecht, R.D. Lambert, K.L. Newcomb, D.M. O'Mara, D.D. Rathman, D.C. Shaver, A.M. Soares, C.N. Stevenson, B.M. Tyrrell, K. Warner, B.D. Wheeler, D.W. Yost, D.J. Young

Institutions: MIT Lincoln Laboratory, Massachusetts Institute of Technology

Language: English

Topic: CCD and CMOS Imaging Sensors

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2139155713

FWCI: 22.54

Cites: 4

Cited by: 123

Related to: 10