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Steve Olson

Metrology needs for through-silicon via fabrication
2014 · Victor H. Vartanian, Richard A. Allen, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 31
Short Loop Electrical and Reliability Learning for Through Silicon Via (tsv)mid-wafer Front-side Processes
2014 · Victor Vartanian, Klaus Hummler, et al. · IMAPSource Proceedings · 2
Metrology Needs for 2.5D/3D Interconnects
2014 · Victor H. Vartanian, Richard A. Allen, et al. · 2
Cost Analysis of TSV Process and Scaling Options
2014 · Victor Vartanian, Larry Smith, et al. · IMAPSource Proceedings · 1
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Fabrication of MEMS Devices with Macroporous Silicon Membrane Embedded with Modulated 3D Structures for Optimal Cell Sorting
2002 · Natalya Tokranova, Xiaojun Feng, et al. · MRS Proceedings · 1
Distributed Optical Sensing in Composite Laminate End-Notched Flexure Tests
2016 · Leeanna Meadows, Vipul Ranatunga Rani Sullivan, et al.
Metrology Needs for TSV Fabrication | NIST
2014 · Victor Vartanian, Richard A. Allen, et al. · Journal of Micro/Nanolithography MEMS and MOEMS
Tsv Reveal Height and Bump Dimension Metrology by the Tsom Method: From Nanometer to Micrometer Scale | Nist
2013 · Ravikiran Attota, Victor Vertanian, et al.
Fabrication of cantilever probes with integrated piezoresistive read-out and built-in piezoelectric actuators
2005 · Steve Olson, Bruce Altemus, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Works count: 10
Citation count: 37
H-index: 2
I10-index: 1
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