Work

Short Loop Electrical and Reliability Learning for Through Silicon Via (tsv)mid-wafer Front-side Processes

Year: 2014

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/isom-thp14

Authors: Victor Vartanian, Klaus Hummler, Steve Olson, Tyler Barbera, Kai-Hung Yu, Shan Hu, Akira Fujita, Fred Wafula, Gyanaranjan Pattanaik, Alison Gracias, Larry Smith, Jack Enloe, Gert Leusink, Kenneth Matthews, Kaoru Maekawa, Brian Sapp

Institutions: University at Albany, State University of New York, Center for Nanoscale Science and Technology, Massachusetts Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2289175935

FWCI: 0.811

Cites: 3

Cited by: 2

Related to: 10