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Wei Yip Loh
Observed names:
W Loh,
W. Loh,
W. Y. Loh,
W.-Y Loh,
W.-Y. Loh,
W.Y. Loh
show all 6
Institution:
Taiwan Semiconductor Manufacturing Company (Taiwan)
Observed institutions:
Agency for Science, Technology and Research,
National University of Singapore,
Institute of Microelectronics,
Institute of Microelectronics,
Taiwan Semiconductor Manufacturing Company (Taiwan)
OpenAlex ID:
A5113687158
Prospect of tunneling green transistor for 0.1V CMOS
2010
·
Chenming Hu
, Pratik Patel
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
112
Impact of interfacial layer control using Gd2O3 in HfO2 gate dielectric on GaAs
2007
·
Goutam Kumar Dalapati
, Yi Tong
, et al.
·
Applied Physics Letters
·
67
Wide $V_{\rm fb}$ and $V_{\rm th}$ Tunability for Metal-Gated MOS Devices With HfLaO Gate Dielectrics
2007
·
X. P. Wang
, H. Y. Yu
, et al.
·
IEEE Electron Device Letters
·
57
First Demonstration of Monolithic CFET Inverter at 48nm Gate Pitch Toward Future Logic Technology Scaling
2024
·
S. Liao
, L. Yang
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
45
STLM: A Sidewall TLM Structure for Accurate Extraction of Ultralow Specific Contact Resistivity
2013
·
Kausik Majumdar
, Saikumar Vivekanand
, et al.
·
IEEE Electron Device Letters
·
22
Charge Trapping and Breakdown Mechanism in HfAlO/TaN Gate Stack Analyzed Using Carrier Separation
2004
·
W.-Y. Loh
, B.J. Cho
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
17
Analysis of charge trapping and breakdown mechanism in high-k dielectrics with metal gate electrode using carrier separation
2004
·
Wei Yip Loh
, Byung Jin Cho
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
17
Integration of GaAs epitaxial layer to Si-based substrate using Ge condensation and low-temperature migration enhanced epitaxy techniques
2007
·
Hoon Jung Oh
, Kyu Jin Choi
, et al.
·
Journal of Applied Physics
·
16
Impact of decoupled plasma nitridation of ultra-thin gate oxide on the performance of p-channel MOSFETs
2002
·
Chun Meng Lek
, Byung Jin Cho
, et al.
·
Semiconductor Science and Technology
·
12
PDF
SiGe CMOS on (110) channel orientation with mobility boosters : Surface orientation, channel directions, and uniaxial strain
2010
·
J. Oh
, S.-H. Lee
, et al.
·
Symposium on VLSI Technology
·
11
Widely Tunable Work Function TaN/Ru Stacking Layer on HfLaO Gate Dielectric
2008
·
X. P. Wang
, M.-F. Li
, et al.
·
IEEE Electron Device Letters
·
9
Temperature programmed decomposition (TPDE) of [Mo(CO)6] on metal oxide supports: a novel tool to elucidate surface acidity and surface-mediated reactions
1998
·
W Loh
·
Talanta
·
9
Work function engineering in silicides: Chlorine doping in NiSi
2011
·
Alexander Slepko
, Alexander A. Demkov
, et al.
·
Journal of Applied Physics
·
8
Correlation between interface traps and gate oxide leakage current in the direct tunneling regime
2002
·
Wei Yip Loh
, Byung Jin Cho
, et al.
·
Applied Physics Letters
·
8
Evolution of quasi-breakdown in thin gate oxides
2002
·
Wei Yip Loh
, Byung Jin Cho
, et al.
·
Journal of Applied Physics
·
8
VLSI processed InGaAs on Si MOSFETs with thermally stable, self-aligned Ni-InGaAs contacts achieving: Enhanced drive current and pathway towards a unified contact module
2013
·
Rinus T. P. Lee
, R. J. W. Hill
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
7
Contact resistance reduction to FinFET source/drain using dielectric dipole mitigated Schottky barrier height tuning
2010
·
B. E. Coss
, C. Smith
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
6
High Specific Contact Resistance of Ohmic Contacts to n-Ge Source/Drain and Low Transport Characteristics of Ge nMOSFETs
2010
·
J. Oh
, J. Huang
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
·
5
(Invited) Technology Options to Reduce Contact Resistance in Nanoscale III-V MOSFETs
2015
·
Rinus T.P. Lee
, Wei Yip Loh
, et al.
·
ECS Transactions
·
4
Dual metal gate process by metal substitution of dopant-free polysilicon on high-K dielectric
2005
·
Chang Seo Park
, Byung Jin Cho
, et al.
·
Symposium on VLSI Technology
·
4
Ultra low contact resistivity (< 1×10−8 Ω-cm2) to In0.53Ga0.47As fin sidewall (110)/(100) surfaces: Realized with a VLSI processed III–V fin TLM structure fabricated with III–V on Si substrates
2014
·
Rinus T.P. Lee
, Y. Ohsawa
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
3
CMOS Scaling with III-V Channels for Improved Performance and Low Power
2011
·
Richard J. Hill
, Jungwoo Oh
, et al.
·
ECS Transactions
·
2
PDF
Localized oxide degradation in ultrathin gate dielectric and its statistical analysis
2003
·
Wei Yip Loh
, Byung Jin Cho
, et al.
·
IEEE Transactions on Electron Devices
·
2
(Invited) Integration Challenges of III-V Materials in Advanced CMOS Logic
2012
·
Richard J. Hill
, Jeff Huang
, et al.
·
ECS Transactions
·
1
PDF
High temperature millisecond silicide anneal for contact resistivity < 10−8 Ωcm2
2011
·
W.-Y Loh
, Y. R. Yang
, et al.
·
International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
·
1
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Works count:
41
Citation count:
456
H-index:
10
I10-index:
10
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