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Horatio Quinones
Observed name:
H. Quinones
OpenAlex ID:
A5113801395
Intelligent Manufacturing Automation
2017
·
Horatio Quinones
, Yang Yong
·
Pan Pacific Symposium
·
56
Ceramic column grid array (CCGA) module for a high performance work station application
2002
·
S.K. Ray
, H. Quinones
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
21
Chip scale packaging reliability
2002
·
H. Quinones
, A. Babiarz
·
International Symposium on Electronic Materials and Packaging (EMAP)
·
9
Jetting technology: a way of the future in dispensing
2003
·
H. Quinones
, A. Babiarz
, et al.
·
International Symposium on Electronic Materials and Packaging (EMAP)
·
5
Intelligent automation; key factor for high mix manufacturing
2017
·
Horatio Quinones
, Yong Yang
·
International Conference on Electronics Packaging (ICEP)
·
1
Fast underfill processes for large to small flip chips.
2001
·
A. Babiarz
, Horatio Quinones
, et al.
·
1
Area Array Interconnect Reliability Prediction Using Stochastically Defined Conditions
1996
·
Horatio Quinones
, Eugene Atwood
, et al.
·
1
Jetting Fine Lines for High Viscosity Fluids onto 2D and 3D Electronic Packages
2013
·
Horatio Quinones
·
Pan Pacific Symposium
HB-LED Cavity Encapsulation
2011
·
Horatio Quinones
, Tom Ratledge
, et al.
·
Pan Pacific Symposium
Capillary Underfill Physical Limitations for Future Packages
2010
·
Horatio Quinones
, Tom Ratledge
·
Pan Pacific Symposium
An Alternative Dispense Process for Application of Catalyst Films on Mea’s
2008
·
Horatio Quinones
, Brian Sawatzky
·
SMTA International
Silicone-Phosphor Encapsulation for High Power White LEDs
2008
·
Horatio Quinones
, Brian Sawatzky
, et al.
·
Pan Pacific Symposium
Enabling Technologies for Applying Fluids in Semiconductor Packaging
2007
·
Alec J. Babiarz
, Horatio Quinones
·
Wafer-Level Packaging Symposium
Jetting: Discrete Dispensing of High Viscosity Fluid
2004
·
Horatio Quinones
, Alec Babiarz
, et al.
·
Pan Pacific Symposium
Underfilling Chip Scale Packages with Reworkable Underfills for Consumer Product Applications
2001
·
Nael Hannan
, Puligandla Viswanadham
, et al.
·
Pan Pacific Symposium
Temperature Effects on Encapsulant Dispensing
1999
·
Christian Q. Ness
, Alan R. Lewis
, et al.
·
Pan Pacific Symposium
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Works count:
20
Citation count:
94
H-index:
4
I10-index:
2
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