Work

Area Array Interconnect Reliability Prediction Using Stochastically Defined Conditions

Year: 1996

Type: article

Authors: Horatio Quinones, Eugene Atwood, E.P. Collins

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3036033705

FWCI:

Cites:

Cited by: 1

Related to: 10