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Kyosuke Kobinata

Observed names: K. Kobinata, Kyosuke KOBINATA
OpenAlex ID: A5113863752
Miniaturized 3D Functional Interposer Using Bumpless Chip-on-Wafer (COW) Integration with Capacitors
2021 · Tatsuya Funaki, Yoshiaki Satake, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19
Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW)
2022 · Yoshiaki Satake, Tatsuya Funaki, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network
2022 · Kyosuke Kobinata, Tatsuya Funaki, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 6
Generation of Si@C/SiC@C core–shell nanoparticles by laser irradiation of silicon grinding waste
2022 · Kanon Minami, Kyosuke Kobinata, et al. · Nano Select · 6
Generating Silicon Nanofiber Clusters from Grinding Sludge by Millisecond Pulsed Laser Irradiation
2020 · Ko Momoki, Kunimitsu Takahashi, et al. · Nanomaterials · 6
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Multilayer Graphene-Coated Silicon Carbide Nanowire Formation Under Defocused Laser Irradiation
2023 · Kanon Minami, Kyosuke Kobinata, et al. · Nanomanufacturing and Metrology · 5
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First-principles study of Schottky barrier behavior at Fe3Si/Ge(111) interfaces
2014 · Kyosuke Kobinata, Takashi Nakayama · Japanese Journal of Applied Physics · 5
Warpage Control Technology using 300 mm Waffle Wafer Evaluated by High-Precision FEM Analysis
2024 · Wataru Doi, Tatsuya Funaki, et al. · International Conference on Electronics Packaging (ICEP) · 4
Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation
2019 · Yi-Lun Yang, Jia-Ling Liu, et al. · International Conference on Electronics Packaging (ICEP) · 4
A Study of Efficiency of Total Volume of Mold Resin for Warpage in COW Process
2024 · Wataru Doi, Yoshiaki Satake, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Precise Warpage Control Technology for 12-Inch Bumpless Via-Last Chip-on-Wafer (COW) by Finite Element Method (FEM)
2023 · Wataru Doi, Tatsuya Funaki, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Voidless Chip-on-Wafer Process for Functional Interposer
2021 · Y. Satake, T. Funaki, et al. · International Conference on Electronics Packaging (ICEP) · 1
Change in Material Structure upon Laser Irradiation of Mixed Target of Si Grinding Waste and Graphite Powder
2024 · Kanon MINAMI, Kyosuke KOBINATA, et al. · Journal of The Japan Society of Electrical Machining Engineers
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Development of Functional Interposer Using Bumpless Chip-on-Wafer - Feasibility Study of Voidless Bonding with Thin Adhesive -
2020 · Yoshiaki Satake, Tatsuya Funaki, et al. · International Conference on Solid State Devices and Materials (SSDM)
First Principles Study of the Relation between Schottky-barrier Change and Interface Structures at Fe 3 Si/Ge Interfaces
2013 · Kyosuke Kobinata · The Japan Society of Applied Physics
Relation between Schottky-barrier change and structural disorders at metal/(Si,Ge) interfaces : First-principles study
2012 · Kyosuke Kobinata, Takashi Nakayama · Technical report of IEICE. SDM
Schottky-barrier change by structural disorders at metal/Si interfaces: First-principles study
2011 · Kyosuke Kobinata, Takashi Nakayama · International Conference on Simulation of Semiconductor Processes and Devices
Schottky-barrier change by structural disorders at metal/Si interfaces: First-principles study
2011 · Kyosuke Kobinata, Takashi Nakayama · IEICE Technical Report; IEICE Tech. Rep.
Schottky-barrier modulation by segregation layers at metal/Si interfaces: first-principles study on chemical trend
2010 · Kyosuke Kobinata, Yusuke Maruta, et al. · IEICE Technical Report; IEICE Tech. Rep.
Works count: 20
Citation count: 72
H-index: 5
I10-index: 2
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