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Yohei Sugawara

Observed names: Sugawara, Yohei, Y. Sugawara
ORCID: 0009-0003-7862-6302
Observed ORCID: 0009-0003-7862-6302
OpenAlex ID: A5113937582
The Development of a Skin Cancer Classification System for Pigmented Skin Lesions Using Deep Learning
2020 · Shunichi Jinnai, Naoya Yamazaki, et al. · Biomolecules · 285
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BayesGrad: Explaining Predictions of Graph Convolutional Networks
2018 · Hirotaka Akita, Kosuke Nakago, et al. · Lecture notes in computer science · 12
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Label-Efficient Multi-task Segmentation Using Contrastive Learning
2021 · Junichiro Iwasawa, Yuichiro Hirano, et al. · Lecture notes in computer science · 11
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Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs
2018 · Hisashi Kino, Sungho Lee, et al. · IEEE International Interconnect Technology Conference (IITC) · 8
Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission
2017 · Hisashi Kino, Masataka Tashiro, et al. · IEEE International Interconnect Technology Conference (IITC) · 8
Einconv: Exploring Unexplored Tensor Decompositions for Convolutional Neural Networks
2019 · Kohei Hayashi, Taiki Yamaguchi, et al. · arXiv (Cornell University) · 7
Einconv: Exploring Unexplored Tensor Network Decompositions for Convolutional Neural Networks
2019 · Hayashi, Kohei, Yamaguchi, Taiki, et al. · arXiv (Cornell University) · 7
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GA-GAN: CT reconstruction from Biplanar DRRs using GAN with Guided Attention
2019 · Sinha, Ashish, Sugawara, Yohei, et al. · arXiv (Cornell University) · 6
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Development of an AI-based magnetic resonance imaging reading support program (AMP) for deep endometriosis diagnosis
2025 · Rie Shiokawa, Junichiro Iwasawa, et al. · Scientific Reports · 5
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TSV liner dielectric technology with spin-on low-k polymer
2018 · S. Lee, Y. Sugawara, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 5
Minimization of Keep-Out-Zone (KOZ) in 3D IC by local bending stress suppression with low temperature curing adhesive
2014 · Hisashi Kino, Hideto Hashiguchi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Creating a general-purpose generative model for healthcare data based on multiple clinical studies
2025 · Hiroshi Maruyama, Kotatsu Bito, et al. · PLOS Digital Health · 4
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Impact of deep-via plasma etching process on transistor performance in 3D-IC with via-last backside TSV
2015 · Yohei Sugawara, Hideto Hashiguchi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC
2015 · Hisashi Kino, Hideto Hashiguchi, et al. · IEEE International D Systems Integration Conference · 3
Assessment of Multidimensional Health Care Parameters Among Adults in Japan for Developing a Virtual Human Generative Model: Protocol for a Cross-sectional Study
2023 · Masanobu Hibi, Shun Katada, et al. · JMIR Research Protocols · 2
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1.5 nm equivalent thickness Ta/sub 2/O/sub 5/ high-k dielectric with rugged Si suited for mass production of high density DRAMs
2002 · I. Asano, M. Kunitomo, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 2
Virtual Human Generative Model: Masked Modeling Approach for Learning Human Characteristics
2023 · Oono, Kenta, Charoenphakdee, Nontawat, et al. · arXiv (Cornell University) · 1
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VesselBridge3D: A Foundation Model Adaptation Framework for Label-Efficient 3D Vessel Segmentation
2026 · Yoshihara, Kirato, Sugawara, Yohei, et al. · arXiv (Cornell University)
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Virtual Human Generative Model: Masked Modeling Approach for Predicting Human Characteristics
2026 · Kenta Oono, Nontawat Charoenphakdee, et al. · Procedia Computer Science
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Anatomical 3D Style Transfer Enabling Efficient Federated Learning with Extremely Low Communication Costs
2024 · Shibata, Yuto, Kudo, Yasunori, et al. · arXiv (Cornell University)
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Evaluation of Depth-dependent Interface States at TSV-liner SiO 2 Using Multi-well Structured TSV
2016 · Yohei Sugawara, Hisashi Kino, et al. · The Japan Society of Applied Physics
Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-Induced Retention Time Modulation of DRAM Cell Array
2015 · S. Tanikawa, H. Hashiguchi, et al. · International Conference on Solid State Devices and Materials (SSDM)
Effect of High-Aspect-Ratio-Via Formation on Transistor Performance in Via-last Backside-via Process for 3D IC
2015 · Yohei Sugawara · The Japan Society of Applied Physics
Evaluation of Plasma-Damage Effects on Transistor Performance in Via-last Backside-via Process for 3D IC
2014 · Yohei Sugawara · The Japan Society of Applied Physics
Works count: 24
Citation count: 374
H-index: 7
I10-index: 3
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