Work

TSV liner dielectric technology with spin-on low-k polymer

Year: 2018

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep.2018.8374320

Authors: S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka

Institutions: Tohoku University, Frontier Research Institute for Interdisciplinary Sciences, Tohoku University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2808020255

FWCI: 0.4

Cites: 8

Cited by: 5

Related to: 10