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Yuqi Cong
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institution:
Advanced Semiconductor Engineering (Taiwan)
OpenAlex ID:
A5114044448
Behaviors of palladium in palladium coated copper wire bonding process
2009
·
Binhai Zhang
, Kaiyou Qian
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
32
Oxidation study of copper wire bonding
2010
·
Xiangquan Fan
, Techun Wang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
10
Properties of Cu-Al intermetallic compounds in copper wire bonding
2010
·
Binhai Zhang
, Techun Wang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
8
Nanoindentation investigation of copper bonding wire and ball
2009
·
Xiangquan Fan
, Kaiyou Qian
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
4
TEM study on the Cu wire stitch bonding interface
2011
·
Xingjie Liu
, Techun Wang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
3
Study on interface of Pd-plated Cu wire stitch bonding
2011
·
Xingjie Liu
, Techun Wang
, et al.
·
International Symposium on Advanced Packaging Materials
·
1
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Works count:
6
Citation count:
58
H-index:
4
I10-index:
2
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