Work

TEM study on the Cu wire stitch bonding interface

Year: 2011

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2011.6067000

Authors: Xingjie Liu, Techun Wang, Yuqi Cong, Jiaji Wang

Institutions: Fudan University, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1990948816

FWCI:

Cites: 11

Cited by: 3

Related to: 10