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Techun Wang

OpenAlex ID: A5063258745
Oxidation study of copper wire bonding
2010 · Xiangquan Fan, Techun Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 10
Improvement of the second bond strength in copper wire bonding on pre-plated leadframe
2011 · Bing An, Lan Ding, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 8
Properties of Cu-Al intermetallic compounds in copper wire bonding
2010 · Binhai Zhang, Techun Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 8
Nanoindentation investigation of copper bonding wire and ball
2009 · Xiangquan Fan, Kaiyou Qian, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Annealing effect and crystallization characteristics of copper wire bonding on pre-plated leadframe
2011 · Bing An, Lan Ding, et al. · International Symposium on Advanced Packaging Materials · 3
TEM study on the Cu wire stitch bonding interface
2011 · Xingjie Liu, Techun Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Investigation of palladium coverage on free air balls of palladium-coated copper wires
2012 · Haonan Pu, Tawei Lo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Study on interface of Pd-plated Cu wire stitch bonding
2011 · Xingjie Liu, Techun Wang, et al. · International Symposium on Advanced Packaging Materials · 1
Microstructure analysis of sputtered copper thin film in packaging substrate
2013 · Ping Lyu, Hongkun Yu, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Modeling of copper wire bonding ball transient temperature behavior
2009 · Techun Wang, QingYi Zheng, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Works count: 10
Citation count: 39
H-index: 4
I10-index: 1
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