Work

Improvement of the second bond strength in copper wire bonding on pre-plated leadframe

Year: 2011

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2011.6066860

Authors: Bing An, Lan Ding, Techun Wang, Tailieh Lu, Liangquan Sun, Yiping Wu

Institutions: Huazhong University of Science and Technology, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2000583405

FWCI: 0.424

Cites: 12

Cited by: 8

Related to: 10