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Jornal of the Microelectronics and Packaging Society
Source type:
journal
Publisher:
Fully OA:
No
DOAJ:
No
OpenAlex ID:
S4306515166
Electromigration Behavior of the Flip-Chip Bonded Sn-3.5Ag-0.5Cu Solder Bumps
2004
·
최재훈
, 전성우
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
5
ITO/Glass 기판위에 PFO-poss 유기 발광층을 가지는 고분자 발광다이오드의 제작
2006
·
유재혁
, Chang Ho Jung
·
Jornal of the Microelectronics and Packaging Society
·
4
Mechanical and Electrical Failure of ITO Film with Different Shape during Twisting Deformation
2017
·
Young-Woo Kwon
, Byoung-Joon Kim
·
Jornal of the Microelectronics and Packaging Society
·
2
Resistive Switching Characteristic of Direct-patternable Amorphous TiOx Film by Photochemical Metal-organic Deposition
2020
·
Yun-Kyeong Hwang
, Wooyoung Lee
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Effects of Adherend Thickness on Adhesive Strength between Organic Adhesive and Metal Adherend
2020
·
Ha Yungeun
, Jun-Hyung Sim
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
The Effect of Crystallinity on the Photoluminescence of TiO2 Nanoparticles
2019
·
한우제
, Hyung‐Ho Park
·
Jornal of the Microelectronics and Packaging Society
·
1
The Structural, Electrical, and Optical Properties of ZnO Ultra-thin Films Dependent on Film Thickness
2019
·
Kyung-Mun Kang
, Yue Wang
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Chemically Bonded Thermally Expandable Microsphere-silica Composite Aerogel with Thermal Insulation Property for Industrial Use
2019
·
Kyu‐Yeon Lee
, Varsha D. Phadtare
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Surface Modification of Ba0.6Sr0.4TiO3 by Trimethylsilyl Chloride as a Silylation Agent
2019
·
Chan Lee
, 한우제
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Effect of Temperature and Compressive Stress on the Dielectric and Piezoelectric Properties of PIN-PMN-PT Single Crystal
2019
·
Lim JaeGwang
, Jae-hwan Park
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders
2019
·
Wook Sang Jeon
, Sri Harini Rajendran
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Improved Photoelectric Conversion Efficiency of Perovskite Solar Cells with TiO2:TiCl4 Electron Transfer Layer
2017
·
Joon-Sub Ahn
, Seung‐gu Kang
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Preparation of 40 wt.% Ag-coated Cu Particles with Thick Ag Shells and Suppression of Defects in the Particles
2017
·
최은별
, Jong‐Hyun Lee
·
Jornal of the Microelectronics and Packaging Society
·
1
A Study of Kirkendall Void Formation and Impact Reliability at the Electroplated Cu/Sn-3.5Ag Solder Joint
2008
·
김종연
, 유진
·
Jornal of the Microelectronics and Packaging Society
·
1
A Study of Post Electrode Formation by MicrowaveSintering in LTCC Substrate
2007
·
김용석
, 이택정
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
High Efficiency Power Conversion System of Non Isolated Type Applied in Fuel Cell Generator Used to Fire Prevention Installation
2006
·
곽동걸
·
Jornal of the Microelectronics and Packaging Society
·
1
Thermal Transient Characteristics of Die Attach in High Power LED Package
2005
·
김현호
, 최상현
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
2005
·
이주원
, 강성권
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Spalling of Intermetallic Compound during the Reaction between Electroless Ni(P) and Lead-free Solders
2004
·
Son Yoon Chul
, 유진
, et al.
·
Jornal of the Microelectronics and Packaging Society
·
1
Deposition Technology of Copper Thin Films for Multi-level Metallizations
2002
·
Nam-Ihn Cho
·
Jornal of the Microelectronics and Packaging Society
·
1
A Study on Growth of Graphene/metal Microwires and Their Electrical Properties
2021
·
Sang Hyun Lee
·
Jornal of the Microelectronics and Packaging Society
Effect of Graphene Oxide Addition to Tin Oxide Aerogel for Photocatalytic Rhodamine B Degradation
2021
·
Hyung‐Ho Park
·
Jornal of the Microelectronics and Packaging Society
The 33-mode Dielectric and Piezoelectric Properties of PIN-PMN-PT Single Crystal under Stress and Electric Field
2020
·
Lim JaeGwang
, Jae-hwan Park
, et al.
·
Jornal of the Microelectronics and Packaging Society
Nanoscale Pattern Formation of Li2CO3 for Lithium-Ion Battery Anode Material by Pattern Transfer Printing
2020
·
Kang Young Lim
, Park Tae Wan
, et al.
·
Jornal of the Microelectronics and Packaging Society
Implementation of Capacitor and Inductor Applied LCP Substrate for 35-GHz frequency band
2020
·
Jiyeon Lee
, Jong-In Ryu
, et al.
·
Jornal of the Microelectronics and Packaging Society
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Works count:
82
Citation count:
28
H-index:
2
I10-index:
2yr mean citedness:
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