Work

Electromigration Behavior of the Flip-Chip Bonded Sn-3.5Ag-0.5Cu Solder Bumps

Year: 2004

Type: article

Source: Jornal of the Microelectronics and Packaging Society

Authors: 최재훈, 전성우, 원혜진, 정부양, Oh Tae Sung

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W274860733

FWCI:

Cites:

Cited by: 5

Related to: 10