Work

Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms

Year: 2015

Type: conference-paper

Source: ASMC proceedings

DOI: 10.1109/asmc.2015.7164444

Authors: Sandip Halder, Vincent Truffert, Dieter van den Heuvel, Philippe Leray, Shaunee Cheng, Greg McIntyre, Kaushik Sah, Jim Brown, Paolo Parisi, Marco Polli

Institutions: IMEC, KLA (United States)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1574776973

FWCI: 1.663

Cites: 4

Cited by: 8

Related to: 10