Author

Shaunee Cheng

Institution: IMEC

Observed institutions: Intel (United States), IMEC

OpenAlex ID: A5111549972

Pitch doubling through dual-patterning lithography challenges in integration and litho budgets

2007 · Mircea Dusa, John Quaedackers, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 91

Double patterning lithography for 32 nm: critical dimensions uniformity and overlay control considerations

2009 · Jo M. Finders, Mircea V. Dusa, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 45

Double patterning for 32nm and below: an update

2008 · Jo Finders, Mircea Dusa, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 42

Sources of overlay error in double patterning integration schemes

2008 · David Laidler, Philippe Leray, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 30

Diffraction based overlay metrology: accuracy and performance on front end stack

2008 · Philippe Leray, Shaunee Cheng, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 29

Natural EUV mask blank defects: evidence, timely detection, analysis and outlook

2010 · Dieter Van den Heuvel, Rik Jonckheere, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 21

Split and design guidelines for double patterning

2008 · Vincent Wiaux, Staf Verhaegen, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 19

Progress in EUV lithography towards manufacturing from an exposure tool perspective

2012 · Jan V. Hermans, David Laidler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 16

Achieving optimum diffraction based overlay performance

2010 · Philippe Leray, David Laidler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 13

Inspection challenges for triple patterning at sub-14 nm nodes with broadband plasma inspection platforms

2015 · Sandip Halder, Vincent Truffert, et al. · ASMC proceedings · 8

Investigation of the performance of state-of-the-art defect inspection tools within EUV lithography

2012 · Dieter Van den Heuvel, Rik Jonckheere, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8

A single metrology tool solution for complete exposure tool setup

2010 · David Laidler, Koen D'havé, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8

High speed optical metrology solution for after etch process monitoring and control

2014 · Anne-Laure Charley, Philippe Leray, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

Application of model-based library approach to photoresist pattern shape measurement in advanced lithography

2010 · Naoki Yasui, Miki Isawa, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

Towards manufacturing a 10nm node device with complementary EUV lithography

2013 · Jan V. Hermans, Huixiong Dai, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Overlay accuracy with respect to device scaling

2012 · Philippe Leray, David Laidler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5

Mix and match overlay optimization strategy for advanced lithography tools (193i and EUV)

2012 · David Laidler, Koen D'havé, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5

Wafer-based aberration metrology for lithographic systems using overlay measurements on targets imaged from phase-shift gratings

2014 · Sven van Haver, Wim M. J. Coene, et al. · Applied Optics · 4

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Verification and extension of the MBL technique for photo resist pattern shape measurement

2011 · Miki Isawa, Maki Tanaka, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4

Overlay metrology for double patterning processes

2009 · Philippe Leray, Shaunee Cheng, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4

Optimization of scatterometry parameters for shallow trench isolation (STI) monitor

2004 · Philippe J. Leray, Shaunee Cheng, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4

Compensating process non-uniformity to improve wafer overlay by RegC

2014 · Philippe Leray, Shaunee Cheng, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

High-speed, full 3D feature metrology for litho monitoring, matching, and model calibration with scatterometry

2012 · Hugo Cramer, Alek Chen, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

3D features measurement using YieldStar: an angle resolved polarized scatterometer

2011 · Anne-Laure Charley, Philippe Leray, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Impact of process decisions and alignment strategy on overlay for the 14nm node

2013 · David Laidler, Koen D’havé, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2

Works count: 48

Citation count: 410

H-index: 9

I10-index: 9