Work

Technology challenges for advanced Cu CMP using a new slurry free process

Year: 2003

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.1999.787088

Authors: M. Matsumoto, K. Suzuki, T. Sakamoto, A. Kamisawa

Institution: ROHM

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1736436264

FWCI:

Cites: 1

Cited by: 3

Related to: 10