Work

A Resistance Change Methodology for the Study of Electromigration in Al-Si Interconnects

Year: 1988

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/irps.1988.362223

Authors: J.A. Maiz, I. Segura

Institutions: Centro de Estudios e Investigaciones Técnicas de Gipuzkoa, Universidad de Navarra

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1762591699

FWCI: 3.846

Cites: 10

Cited by: 17

Related to: 10