Work

Critical issues in the integration of copper and low-k dielectrics

Year: 2003

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.1999.787139

Authors: R.A. Donaton, B. Coenagrachts, K. Maex, H. Struyf, S. Vanhaelemeersch, G. Beyer, E. Richard, I. Vervoort, W. Fyen, J. Grillaert, S. Van der Groen, M. Stucchi, D. De Roest

Institution: IMEC

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1908492041

FWCI: 0.786

Cites: 2

Cited by: 2

Related to: 10