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Author

Joost Grillaert

Observed name: J. Grillaert
Observed institution: IMEC
OpenAlex ID: A5050366555
A Static Model for Scratches Generated during Aluminum Chemical-Mechanical Polishing Process: Orbital Technology
1999 · Lei Zhong, Jerry Yang, et al. · Japanese Journal of Applied Physics · 23
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A New Dummy-Free Shallow Trench Isolation Concept for Mixed-Signal Applications
2000 · G. Badenes, R. Rooyackers, et al. · Journal of The Electrochemical Society · 13
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Modelling the influence of pad bending on the planarization performance during CMP
1999 · Joost Grillaert, M. Meuris, et al. · MRS Proceedings · 13
Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies
1998 · K. Devriendt, Evi Vrancken, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4
Critical issues in the integration of copper and low-k dielectrics
2003 · R.A. Donaton, B. Coenagrachts, et al. · IEEE International Interconnect Technology Conference (IITC) · 2
Cleaning, rinsing and drying issues in post-Cu CMP cleaning: A case study
2023 · W. Fyen, R. Vos, et al. · CRC Press eBooks · 1
Cleaning, rinsing and drying effects in post-Cu CMP clean
2000 · Wim Fyen, Rita Vos, et al. · 1
A new scaling issue in the electrical behaviour of damascene vs. plasma-etched interconnects
1998 · Joris Proost, Thierry Conard, et al. · Digital Access to Libraries (Université catholique de Louvain (UCL), l'Université de Namur (UNamur) and the Université Saint-Louis (USL-B)) · 1
Modelling the influence of pad bending on the planarization performance during CMP
2000 · Joost Grillaert, Marc Meuris, et al.
Advanced solutions for copper and low k technology
2000 · Gerald Beyer, Mikhaı̈l R. Baklanov, et al.
Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
2000 · R. A. Donaton, B. Coenegrachts, et al.
Characterization of Slurry System and Suppression of Oxide Erosion in Aluminum CMP (Chemical-Mechanical Planarization)
1999 · Lei Zhong, Jerry Yang, et al. · MRS Proceedings
Influence of the height difference between the first and second nitride layer on erosion and dishing in the dual nitride approach for shallow trench isolation
1998 · N. Heylen, Joost Grillaert, et al.
Reduction of the premetal dielectric thermal budget for a 0.35mm technology
1996 · J. Waeterloos, H. Meynen, et al.
Works count: 14
Citation count: 58
H-index: 4
I10-index: 3
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