Work

Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects

Year: 2009

Type: article

Source: Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena

DOI: 10.4028/www.scientific.net/ssp.145-146.381

Authors: Xun Gu, Takenao Nemoto, Akinobu Teramoto, Rui Hasebe, Takashi Ito, Tadahiro Ohmi

Institution: Tohoku University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1965446972

FWCI: 0.813

Cites:

Cited by: 6

Related to: 10