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Takenao Nemoto

The characteristics of hydrogen diffusion and concentration around a crack tip concerned with hydrogen embrittlement
2002 · A.Toshimitsu Yokobori, Yasrou Chinda, et al. · Corrosion Science · 112
Numerical analysis on hydrogen diffusion and concentration in solid with emission around the crack tip
1996 · A.Toshimitsu Yokobori, Takenao Nemoto, et al. · Engineering Fracture Mechanics · 111
Effect of Additives in Organic Acid Solutions for Post-CMP Cleaning on Polymer Low-k Fluorocarbon
2009 · Xun Gu, Takenao Nemoto, et al. · Journal of The Electrochemical Society · 24
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End-Point Detection of Ta/TaN Chemical Mechanical Planarization via Forces Analysis
2010 · Yasa Sampurno, Xun Gu, et al. · Japanese Journal of Applied Physics · 20
In situ Observation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction
2009 · Takenao Nemoto, Tatsuya Fukino, et al. · Japanese Journal of Applied Physics · 15
Tribological Study of Brush Scrubbing in Post-Chemical Mechanical Planarization Cleaning in Non-porous Ultralow-k Dielectric∕Cu Interconnects
2011 · Xun Gu, Takenao Nemoto, et al. · Journal of The Electrochemical Society · 13
Numerical Analysis on Hydrogen Diffusionin Solid Around The Crack Tip.
1993 · Toshimitsu Jr. Yokobori, Takenao Nemoto, et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 12
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Tribological Effects of Brush Scrubbing in Post Chemical Mechanical Planarization Cleaning on Electrical Characteristics in Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects
2011 · Xun Gu, Takenao Nemoto, et al. · Japanese Journal of Applied Physics · 11
The application of the analysis of potential driven particle diffusion to the strength of materials
2011 · A. Toshimitsu Yokobori, Toshihito Ohmi, et al. · Strength Fracture and Complexity · 9
Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process
2009 · Yasa Sampurno, Yun Zhuang, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 9
A Theoretical Analysis of Electromigration Failure in Aluminum Interconnections
2006 · Takenao Nemoto, A. Toshimitsu Yokobori, Jr., et al. · Japanese Journal of Applied Physics · 9
Numerical Analysis of Vacancy Transport by Residual Stress in Electromigration on LSI Interconnects
2010 · Takenao Nemoto, Toshimitsu A. Yokobori, Jr., et al. · Japanese Journal of Applied Physics · 7
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Electrical Characteristics of Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond
2011 · Xun Gu, Takenao Nemoto, et al. · Japanese Journal of Applied Physics · 6
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Prediction of Stress Induced Voiding Reliability in Cu Damascene Interconnect by Computer Aided Vacancy Migration Analysis
2011 · Haruhisa Shigeyama, Takenao Nemoto, et al. · Japanese Journal of Applied Physics · 6
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Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects
2009 · Xun Gu, Takenao Nemoto, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 6
Novel End-point Detection Method by Monitoring Shear Force Oscillation Frequency for Barrier Metal Polishing in Advanced LSI
2009 · Xun Gu, Takenao Nemoto, et al. · MRS Proceedings · 6
Cu Single Damascene Integration of an Organic Nonporous Ultralow- $k$ Fluorocarbon Dielectric Deposited by Microwave-Excited Plasma-Enhanced CVD
2012 · Xun Gu, Takenao Nemoto, et al. · IEEE Transactions on Electron Devices · 4
Advanced Direct-Polishing Process Development of Non-Porous Ultralow-kDielectric Fluorocarbon with Plasma Treatment on Cu Interconnects
2012 · Xun Gu, Takenao Nemoto, et al. · Journal of The Electrochemical Society · 4
Advanced Direct-Polish Process on Organic Non-Porous Ultra Low-k Fluorocarbon Dielectric on Cu Interconnects
2011 · Xun Gu, Takenao Nemoto, et al. · ECS Transactions · 4
Numerical Analysis for Electromigration of Cu Atom
2006 · Takenao Nemoto, Tutomu Murakawa, et al. · Journal of the Japan Institute of Metals and Materials · 4
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Cu behaviors induced by aging and their effects on electromigration resistance on Al-Cu lines
1996 · Takeshi Nogami, Takenao Nemoto · AIP conference proceedings · 4
Robust Ultralow-k Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition
2012 · Yoshiyuki Kikuchi, Kotaro Miyatani, et al. · Japanese Journal of Applied Physics · 2
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Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-k Dielectric Fluorocarbon on Advanced Cu Interconnects
2012 · Xun Gu, Yugo Tomita, et al. · Japanese Journal of Applied Physics · 2
Silicon Wafer Thinning Technology for Three-Dimensional Integrated Circuit by Wet Etching
2009 · Kazuhiro Yoshikawa, Tomotsugu Ohashi, et al. · IEICE Technical Report; IEICE Tech. Rep. · 2
Optimizing Pad Groove Design and Polishing Kinematics for Reduced Shear Force, Low Force Fluctuation and Optimum Removal Rate Attributes of Copper CMP
2009 · Yasa Sampurno, Ara Philipossian, et al. · MRS Proceedings · 2
Works count: 45
Citation count: 413
H-index: 9
I10-index: 8
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