Work

Innovative wafer-level encapsulation & underfill material for silicon interposer application

Year: 2013

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2013.6575658

Authors: C. Ferrandon, A. Jouve, S. Joblot, Y. Lamy, A. Schreiner, P. Montmeat, M. Pellat, M. Argoud, F. Fournel, G. Simon, S. Cheramy

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, STMicroelectronics (France)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1978379671

FWCI: 4.073

Cites: 14

Cited by: 20

Related to: 10