Get started
Author

Pierre Montméat

Observed names: MONTMEAT, Pierre, Montmeat, Pierre, Montméat, P., Montméat, Pierre, P Montmeat, P Montméat, P. Montmeat, P. Montméat, P. Montméat, Pierre MONTMEAT,, Pierre MONTMÉAT, Pierre Montmeat, Pierre Montméat
Observed institutions: École Nationale Supérieure de Chimie de Montpellier, Centre National de la Recherche Scientifique, Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Mines Saint-Étienne, CEA Grenoble, Georges Friedel Laboratory, CEA Le Ripault, Laboratoire d'Électronique des Technologies de l'Information, Laboratoire des Procédés en Milieux Granulaires Granulaires, Université Grenoble Alpes
ORCID: 0000-0002-8467-4939
Observed ORCID: 0000-0002-8467-4939
OpenAlex ID: A5024257598
Physico-chemical contribution of gold metallic particles to the action of oxygen on tin dioxide sensors
2003 · Pierre Montmeat, Jean-Claude Marchand, et al. · Sensors and Actuators B Chemical · 84
Ultra trace detection of explosives in air: Development of a portable fluorescent detector
2010 · Thomas Caron, Marianne Guillemot, et al. · Talanta · 78
Application of membranes and filtering films for gas sensors improvements
2005 · C. Pijolat, J.P. Viricelle, et al. · Thin Solid Films · 60
Metalloporphyrins as sensing material for quartz-crystal microbalance nitroaromatics sensors
2005 · P. Montmeat, S. Madonia, et al. · IEEE Sensors Journal · 38
The influence of a platinum membrane on the sensing properties of a tin dioxide thin film
2002 · Pierre Montmeat, Christophe Pijolat, et al. · Sensors and Actuators B Chemical · 34
Model of the thickness effect of SnO2 thick film on the detection properties
2004 · P. Montmeat, R. Lalauze, et al. · Sensors and Actuators B Chemical · 31
Study of calixarenes thin films as chemical sensors for the detection of explosives
2013 · P. Montmeat, F. Veignal, et al. · Applied Surface Science · 30
Comparison of fluorescence and QCM technologies: Example of explosives detection with a π-conjugated thin film
2010 · Simon Clavaguera, Pierre Montméat, et al. · Talanta · 26
Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration
2022 · Alice Bond, Emilie Bourjot, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications
2017 · P. Montméat, T. Enot, et al. · Microelectronic Engineering · 22
Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding
2023 · Emilie Bourjot, Alice Bond, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers
2019 · K. Abadie, P. Montméat, et al. · International Journal of Adhesion and Adhesives · 21
PDF
Innovative wafer-level encapsulation & underfill material for silicon interposer application
2013 · C. Ferrandon, A. Jouve, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 20
Efficient Sensing of Explosives by Using Fluorescent Nonporous Films of Oligophenyleneethynylene Derivatives Thanks to Optimal Structure Orientation and Exciton Migration
2014 · Thomas Caron, Eric Pasquinet, et al. · Chemistry - A European Journal · 15
Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology
2015 · P. Montméat, T. Enot, et al. · Microsystem Technologies · 14
(Invited) Hybrid Bonding for 3D Applications: Improvements and Limitations
2023 · Emilie Deloffre, Bassel Ayoub, et al. · ECS Transactions · 13
PDF
Detection of explosives vapours using a multi-quartz crystal microbalance system
2010 · Christelle Barthet, Pierre Montméat, et al. · Procedia Engineering · 13
Alternated π‐conjugated polymers based on a 1,2‐diiminocyclohexane chiral unit for nitroaromatics sensing
2009 · Simon Clavaguera, Olivier J. Dautel, et al. · Journal of Polymer Science Part A Polymer Chemistry · 13
Initiated Chemical Vapor Deposition of polysiloxane as adhesive nanolayer for silicon wafer bonding
2022 · Pierre Montméat, Jérôme Dechamp, et al. · Materials Science in Semiconductor Processing · 12
PDF
Transparent PZT MIM Capacitors on Glass for Piezoelectric Transducer Applications
2019 · Gwenael Le Rhun, Christel Dieppedale, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 12
Development and adhesion characterization of a silicon wafer for temporary bonding
2018 · P. Montméat, T. Enot, et al. · International Journal of Adhesion and Adhesives · 11
Polymer bonding temperature impact on bonded stack morphology and adherence energy
2017 · P. Montméat, T. Enot, et al. · Microsystem Technologies · 11
Effect of a platinum membrane on the sensing properties of materials based on thin and thick tin dioxide films
2002 · Pierre Montmeat, Christophe Pijolat, et al. · Materials Science and Engineering C · 11
Large Scale Integration of Functional Radio‐Frequency Flexible MEMS under Large Mechanical Strain
2022 · Edy Azrak, Laurent Michaud, et al. · Advanced Functional Materials · 9
PDF
A simple thermodynamic approach to predict responses from polymer-coated quartz crystal microbalance sensors exposed to organic vapors
2013 · P. Palmas, J. Klingenfus, et al. · Talanta · 9
Works count: 84
Citation count: 756
H-index: 14
I10-index: 23
Year
Topic
Type