Work

Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

Year: 2017

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2017.03.008

Authors: P. Montméat, T. Enot, M. De Marco Dutra, M. Pellat, F. Fournel

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2602688366

FWCI: 1.004

Cites: 23

Cited by: 22

Related to: 10