Work

Solder prefrom application

Year: 2011

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2011.6066925

Authors: Hu Yu, Shen Ming, Angela Gong, Alan Lu

Institution: Siemens (China)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1978548102

FWCI:

Cites:

Cited by: 1

Related to: 10