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Angela Gong
Institution:
Siemens (China)
Observed institution:
Siemens (China)
OpenAlex ID:
A5079464591
Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy
2010
·
Yiqing Wang
, Dongyan Ding
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
6
Solder prefrom application
2011
·
Hu Yu
, Shen Ming
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
1
Microstructural characterization of electroplating Sn on lead-frame alloys
2009
·
Yiqing Wang
, Dongyan Ding
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
1
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Works count:
3
Citation count:
8
H-index:
1
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