Work

Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy

Year: 2010

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2010.5582636

Authors: Yiqing Wang, Dongyan Ding, Ting Liu, Klaus-Peter Galuschki, Yu Hu, Angela Gong, Ming Shen, Hongqi Sun, Xianfeng Wang, Jiangyan Sun, Ming Li, Dali Mao

Institutions: Shanghai Jiao Tong University, State Key Laboratory of Metal Matrix Composites, Siemens (China)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2000820966

FWCI: 1.281

Cites: 4

Cited by: 6

Related to: 10