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Jiangyan Sun
OpenAlex ID:
A5113542165
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
2009
·
Xiaowu Zhang
, T.C. Chai
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
113
Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer
2011
·
Tai Chong Chai
, Xiaowu Zhang
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
56
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps
2012
·
Qinghua Zhao
, Anmin Hu
, et al.
·
Microelectronics Reliability
·
13
Investigation of competitive adsorption between accelerator and suppressor in TSV copper electroplating
2012
·
Yue Lu
, Haiyong Cao
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
11
The study on the shaping of electroplated copper pillar bumping
2011
·
Ying Han
, Ming Li
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
6
Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy
2010
·
Yiqing Wang
, Dongyan Ding
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
6
Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump
2011
·
Fengwei Dai
, Daquan Yu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Effect of different pretreatments on through silicon via copper filling
2013
·
Yi Li
, Haiyong Cao
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
4
Pure Bottom-up filling process for efficient TSV metallization
2013
·
Li Ma
, Huiqin Ling
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
4
Electrochemical analysis of cathode in TSV copper electroplating
2012
·
Haiyong Cao
, Xue Feng
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
2
Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction
2012
·
Wen Yin
, Daquan Yu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
1
Effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution
2012
·
Chao Li
, Anmin Hu
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Effect of deposit microstructure on the reflow discoloration of electroplating pure tin
2011
·
Hongqi Sun
, Jiangyan Sun
, et al.
·
International Symposium on Advanced Packaging Materials
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Works count:
13
Citation count:
221
H-index:
6
I10-index:
4
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