Work

Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6249068

Authors: Wen Yin, Daquan Yu, Fengwei Dai, Chongshen Song, Zhang Bo, Lixi Wan, Han Yu, Jiangyan Sun

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Chinese Academy of Sciences

OpenAlex ID: W2014587141

FWCI: 0.405

Cites: 16

Cited by: 1

Related to: 10