Work

Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump

Year: 2011

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2011.6184410

Authors: Fengwei Dai, Daquan Yu, Wen Yin, Ning Zhao, Lixi Wan, Han Yu, Su Wang, Jiangyan Sun

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1985363363

FWCI: 0.847

Cites: 11

Cited by: 5

Related to: 10