Work

The study on the shaping of electroplated copper pillar bumping

Year: 2011

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept.2011.6066842

Authors: Ying Han, Ming Li, Hongqi Sun, Jiangyan Sun

Institutions: Shanghai Jiao Tong University, State Key Laboratory of Metal Matrix Composites

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Shanghai Jiao Tong University, National Science and Technology Major Project

OpenAlex ID: W1997435259

FWCI:

Cites: 10

Cited by: 6

Related to: 10