Work

Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films

Year: 1995

Type: article

Source: MRS Proceedings

DOI: 10.1557/proc-391-309

Authors: R.-M. Keller, W.-M. Kuschke, A. Kretschmann, S. Bader, R.P. Vinci, E. Arzt

Institutions: University of Stuttgart, Max Planck Society, Hewlett-Packard (United States), Stanford University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1989459459

FWCI: 0.309

Cites: 10

Cited by: 3

Related to: 10