Author

Andre Kretschmann

Observed names: A Kretschmann, A. Kretschmann, André Kretschmann, Kretschmann, A.

Observed institutions: University of Stuttgart, Max Planck Society, Cornell University, Robert Bosch (Germany)

OpenAlex ID: A5084449585

Thermomechanical behavior of different texture components in Cu thin films

2001 · S.P Baker, A Kretschmann, et al. · Acta Materialia · 136

1998 · W-M. Kuschke, A. Kretschmann, et al. · Journal of materials research/Pratt's guide to venture capital sources · 41

Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

2010 · Eric Nguegang, Jochen Franz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 16

Plastic Deformation in Thin Copper Films Determined by X-Ray Micro-Tensile Tests

1996 · A. Kretschmann, W.-M. Kuschke, et al. · MRS Proceedings · 15

Deformation Mechanisms in Thin Cu Films

1998 · Shefford P. Baker, Rose-Marie Keller, et al. · MRS Proceedings · 12

Influence of process variation on the functionality of a high-pressure sensor

2002 · Joerg Muchow, Andre Kretschmann, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films

1995 · R.-M. Keller, W.-M. Kuschke, et al. · MRS Proceedings · 3

Mit Physik gesellschaftlichen Fortschritt gestalten

2026 · André Kretschmann · Physik in unserer Zeit

Quantum Sensors – The Journey from the Lab to a Product of Daily Life

2025 · André Kretschmann, Thomas Strohm, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems

Works count: 10

Citation count: 230

H-index: 6

I10-index: 5