Work

Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45nm

Year: 2007

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2007.06.014

Authors: A. Roule, M. Amuntencei, E. Deronzier, P.H. Haumesser, S. Da Silva, X. Avale, O. Pollet, R. Baskaran, G. Passemard

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1990304133

FWCI: 0.368

Cites: 14

Cited by: 41

Related to: 10