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Xavier Avale
Observed names:
Avale, Xavier,
X Avale,
X. Avale
OpenAlex ID:
A5017380296
Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45nm
2007
·
A. Roule
, M. Amuntencei
, et al.
·
Microelectronic Engineering
·
41
Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers
2006
·
T. Decorps
, P.H. Haumesser
, et al.
·
Microelectronic Engineering
·
29
Copper post-electroplating anneal: evaluation of in-line vs. furnace anneal on layer properties
2003
·
P.H Haumesser
, T Mourier
, et al.
·
Microelectronic Engineering
·
6
Gold Wet Etch Optimization on 200mm Substrates for MEMS Applications
2009
·
Laurence Gabette
, Roselyne Segaud
, et al.
·
ECS Transactions
·
5
Copper Seeding and Filling: New Strategies for the 32 nm Node
2007
·
Paul-Henri Haumesser
, Anne Roule
, et al.
·
ECS Meeting Abstracts
·
1
PDF
Wet process optimization to deposit conformal Cu diffusion barrier into TSV
2011
·
C. Pernel
, X. Avale
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
Gold Wet Etch Optimization on 200 mm Substrates for MEMS Applications
2009
·
Laurence Gabette
, Roselyne Segaud
, et al.
·
ECS Meeting Abstracts
PDF
Electroless deposition of Co-based barriers: selectivity, corrosion and growth properties.
2006
·
Decorps, Tifenn
, Haumesser, Paul-Henri
, et al.
·
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Works count:
8
Citation count:
82
H-index:
4
I10-index:
2
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