Work

Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers

Year: 2006

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2006.09.012

Authors: T. Decorps, P.H. Haumesser, S. Olivier, A. Roule, M. Joulaud, O. Pollet, X. Avale, G. Passemard

Institutions: STMicroelectronics (France), Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: Centre National de la Recherche Scientifique

OpenAlex ID: W2057329623

FWCI: 3.178

Cites: 4

Cited by: 29

Related to: 10