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Wet process optimization to deposit conformal Cu diffusion barrier into TSV

Year: 2011

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2011.5940327

Authors: C. Pernel, X. Avale, M. Veillerot, L. Hortemel, P. Leduc, T. Ritzdorf

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, Applied Materials (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2155756263

FWCI:

Cites: 2

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Related to: 10