Work

Studies on A New Sela-FIB Sample Preparation Method and Its Application in Failure Analysis of Wafer Fabrication for 110nm Technology Node and Beyond

Year: 2006

Type: conference-paper

Source: IEEE International Conference on Semiconductor Electronics

DOI: 10.1109/smelec.2006.380784

Authors: Zhao Siping, Hua Younan, Er Eddie, Khoo Ley Hong

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1992198214

FWCI: 0.528

Cites: 2

Cited by: 1

Related to: 10