Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Zhao Siping
Observed name:
Siping Zhao
Institution:
ST Engineering (Singapore)
Observed institutions:
Ministry of Foreign Affairs,
National Heritage Board,
ST Engineering (Singapore)
OpenAlex ID:
A5111694896
Studies on Electron Penetration Versus Beam Acceleration Voltage in Energy-Dispersive X-Ray Microanalysis
2006
·
Sharon Lee
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
16
Failure Analysis of Pitting Problem on Microchip Al Bondpads in Wafer Fabrication
2006
·
Tai Eve
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
8
Studies of Silicon Dust Corrosion on Microchip Al Bondpads and Elimination of Silicon Dust During Wafer Sawing Process
2006
·
Hua Younan
, Zhao Siping
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
7
Investigation and Failure Analysis of "Flower-like" Defects on Microchip Aluminum Bondpads in Wafer Fabrication
2006
·
Hua Younan
, Lim Yeow Kheng
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
5
Failure Analysis of NSOP Problem Due to Al Fluoride Oxide on Microchip Al Bondpads
2006
·
Zhao Siping
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
4
Studies of Galvanic Corrosion (Al-Ti Cell) on Microchip Al Bondpads and Elimination Solutions
2007
·
Hua Younan
, Mo Zhiqiang
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
2
Studies on Failure Mechanism of Al Fluoride Oxide-AlxOyFz on Microchip Al Bondpads
2006
·
Hua Younan
, Zhao Siping
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
2
Studies on Failure Mechanism of ET High Via Resistance in Wafer Fabrication
2006
·
Hua Younan
, Tan Sock Khim
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
2
Studies on A New Sela-FIB Sample Preparation Method and Its Application in Failure Analysis of Wafer Fabrication for 110nm Technology Node and Beyond
2006
·
Zhao Siping
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
1
Plane-view Transmission Electron Microscopy for Advanced Integrated Circuit
2006
·
Pan Liu
, K. Li
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
1
An FIB Method Using Progressive Multi-Cut Technique & Application in Failure Analysis of Wafer Fabrication
2006
·
Khoo Ley Hong
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
·
1
Meeting the Challenges of Elemental Analysis in 90nm & Beyond Technologies - Case Studies of Scanning Auger Nanoprobe
2006
·
Nistala Ramesh Rao
, Tan Chin Wang
, et al.
·
IEEE International Conference on Semiconductor Electronics
Auger PID Characterization of Threshold Voltage Shift and Application in Bond pad Monitoring of Wafer Fabrication
2006
·
YH Marcus Tan
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
Analysis of Airborne Boron and Phosphorus Contaminations on Wafer Surface by TOF-SIMS
2006
·
Mo Zhiqiang
, Gui Dong
, et al.
·
IEEE International Conference on Semiconductor Electronics
Studies on A Sample Preparation Method for HR-SEM and Application in Failure Analysis of Trench TEOS Gauging Measurement in Wafer Fabrication
2006
·
Zhao Siping
, Hua Younan
, et al.
·
IEEE International Conference on Semiconductor Electronics
Show more works
View as search
Works count:
15
Citation count:
49
H-index:
4
I10-index:
1
Year
Topic
Type
