Work

The study of backside TSV reveal process by direct Si/Cu grinding and polishing

Year: 2013

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2013.6745826

Authors: Kai Xue, Daquan Yu, Yuesheng Li, Feng Jiang, Haiyan Liu, Qibing Wang, Fengwei Dai

Institutions: National Center for Advanced Packaging (China), Fudan University, Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1994629640

FWCI: 0.408

Cites: 5

Cited by: 5

Related to: 10