Reduced electromigration of Cu wires by surface coating
Year: 2002
Type: article
Source: Applied Physics Letters
DOI: 10.1063/1.1504491
Authors: C.-K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, X. Chen, A. K. Stamper
Language: English
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1996013151